GF系列導熱軟墊
Thermally Conductive Pads for Heat Management
•Soft thermally-conductive materials designed to enable dispensing application for high volume manufacturing operations
•High-power performance in thermal conductivity and electrical insulation
•Types of thermal interface materials include thermal pad, thermal tape, thermal grease, and thermal putty
•Generally used in all heat dissipation modules to fill the gaps and uneven holes on the surface of the electronic materials
•Customization service available for discussion upon request
導熱軟墊
P/N : GF-866A / 868B / 866BF / 866G / 868G
Color: Pink, Grey, Green
Thickness : 0.3mm ~ upon request
Available: Sheet and die cut part
Thermal Conductivity : 1.0 ~ 10 W/m-K
UL Number: E315996
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