光罩對準曝光機

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光罩對準曝光機

AG Mask Aligner Specification Light Source: NUV/DUV light source: 350W, 500W, 1000W. 2KW, 5 KW

AG Mask Aligner Specification Light Source: NUV/DUV light source: 350W, 500W, 1000W. 2KW, 5 KW, 8KW Exposure area :4”,6”, 8”, 10”, 12”or larger (up to 24”) Wavelength: NUV (included 365nm, 400nm, 436nm.), DUV (220nm, 254nm...etc.) Uniformity: ±1~3% to ± 5% Power supply: Two Channels (Channel A/B) with CI/CP mode  Regular (CP: Constant Power) and/or Intensity Control (CI: Constant Intensity & CP) type Image (Microscope) system: Dual CCD Camera Alignment System : 50X-300X , 90X-600X , 180X~1200x or 250X-1500X Lens Tubes with Video zoom magnification B & W (or Color) Monitors: 9”, 12”, 14”, 17” Ring illumination: (2-separate fiber rings), adjustable fiber optic illuminators, Camera separation range : less ring illuminators 4.3cm~ 20 cm (option with Prism could be smaller to 10cm) Camera Purge hood could be option – prevent particle Single field or Split filed Microscope option is available. Alignment Fixture: Mask vacuum chuck: 4”, 5”, 7”, 9” or Larger (either top or bottom load are all available) Wafer(substrate) vacuum chuck: round or Square 2”, 4”, 6” 8”, Larger all with multi substrate and pre-alignment pin Mask , Wafer Auto leveling (planarize ) function Adjustable Vacuum pressure With Proximity, Hard , Soft Contact mode X,Y axis adjustment range: 12mm with resolution 1um (Option 0.1um) Θ axis adjustment range: ±3° in Theta with 0.0001° increment Z axis adjustment range: 6mm, resolution 1um Manual or Auto (option) Load unload wafer (substrate) N2 purge in between the wafer and mask and wafer. UV expose and the Nano imprint aspect ratio can be 10:1 with 300 um thickness PR (option item). Operation system: PLC or computer with Touch panel control interface, plus the operator control switch box. Pneumatics & electronics valve control system Timer: 0.1-999 sec / Emergency StopMask Vacuum : 0~ 25” Hg Wafer Vacuum: 0~ 25” Hg Auto leveling in between Mask vs. substrate Auto Z axis: auto gape adjustment—only input the gape value in between mask and wafer—i.e. 100um, then optical encoder and step motor system will automatically do the leveling and also gape tuning. System power (light source, illuminator, power supply ,) integrate at same panel Control the Nano Imprint pressure by motor and also Air Cylinder (option item). Vibration proof table (option): 1)Integrate 4 vibration pads with Al. or SUS frame to support Aligner 2) Option with the granite plate for Vibration isolation is available. 3) Integrate TMC or New Port vibration proof table with Aligner - Could integrate auto light shutter Performance: Production speed : 2~4 pcs/minutes With Vacuum hard contact: the printing resolution could be from 1.0 (NUV) and 0.5um (DUV) With proximity mode: the printing resolution is 2~5um] Other then Standard system, We could build up Customized system for you!!
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