12inchAluminumWAFER
直徑Diameter(mm) | 12 Inch(300±0.5mm) |
厚度Thickness (µ m) | ≧650 |
邊緣模式Wafer Edge | Notch |
表面處理Surface Treatment | 正面拋光Front side polished/背面拋光polished |
金屬厚度Metallization Thinkness | 7000A+/-10% |
Bow/WARP (µ m) | ≦50um |
TTV (µ m) | ≦50um |
包裝package | 25pcs/cassette |
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