Wafer Bonder

Description: AST Samurai Wafer Bonding System provides the complete product line covering the production scale from volume production, pilot production to RD platform for wafer level bonding application. Samurai Wafer Bonding System has served Industry Application of worldwide customers from LED, Compound Semiconductor, MEMS, BioChip, Advanced Packaging, and EMI Device. 1) Metal (Eutectic) Bonding 2) Adhesive (Glue, Expoxy) 3) Anodic Bonding 4) Thermal Direct Bonding 5) Alignment Bonding 6) Advanced Packaging Bonding 7) 3D Packaging Bonding Features: Samurai series has system configuration for Eutectic, Adhesive, Anodic bonding, with independent temperature, precise bonding pressure, voltage control and alignment mechanism design suitable for different customer application. Specification: Standard Vacuum Model handling wafer size from 2"~8" available. Please contact AST for your application. Safety Approval: TUV Country of Origin: Taiwan Main Export Markets: Worldwide